Webinar: The Rise of the Chiplet
Chiplet technology is on the rise. Although the idea of chiplets has existed for decades, chiplet-based packaging is driving new types of components, products, and systems for specialized applications. Some believe the future of chip innovation lies in moving to modular designs based on “chiplet” building blocks, essentially moving from system-on-chip (SoC) to System-on-Package (SoP) chip architectures. So, when will this happen? What are the benefits? And what will spur adoption? We will talk about that, and more this Thursday, February 9th with moderator, Brian Bailey (SemiEngineering), and panelists Nick Ilyadis (Achronix), Rich Wawrzyniak (Semico), and Bapi Vinnakota (ODSA). Join us live to be part of the conversation and ask questions during the discussion!
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