Road to Chiplets: Architecture – Jan Vardaman: Why Chiplets?

Road to Chiplets: Architecture
Why Chiplets?
Jan Vardaman
Techsearch International

New packaging solutions are being adopted to achieve the economic advantages that were previously met with silicon scaling. The role of heterogeneous integration, especially chiplets, is pivotal in this new era. This presentation examines the drivers for chiplets in both sided-by-side and 3D configurations. Applications that benefit from the use of chiplets will be highlighted.

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