Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)

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Channel: Intel Newsroom • Sourced: Youtube • Published 1 year ago

Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)

At Intel Innovation 2022, Pat Gelsinger explains how #Intel helped form the Universal Chiplet Interconnect Express (UCIe) consortium “to create an open chiplet ecosystem.” More than 80 companies in the #semiconductor industry have joined to make an open chiplet interface a reality, including TSMC and Samsung. #IntelON

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